Small-Scale Integration (SSI) chips with 1 to 10 gates per chip, allowing a chip to implement a more complex
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The second level sits roughly flush with the top of the controller die, providing four electrical contacts on one side and two on the other that are connected to the six pins of the controller by gold ball bonds. I didn’t measure connectivity from these pads to package pins or the crystal, but based on the general floorplan of the device my educated guess is that the four corner pins connect to the package pins, while the two center pins connect to the quartz crystal (sitting above the controller on the third level).